200333-8

AMP200333-8
ICC Number:AMP200333-8
Manufacturer:TE Connectivity
Manufacturer Number:200333-8
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SKT CONT ASSY, SZ 16, TYPE II

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Specifications

AttributeValue
Product Category:
Power Connectors Battery & Coin Cell Clips, Contacts & Holders
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 200333-8
Series:AMP Type II
Accessory Type:Contact
Termination Method:Crimp
Contact Material:Brass
Contact Size:16
Contact Type:Socket
Cable Type:Discrete Wire
Contact Amperage:13 A
Number of Positions:1
Termination Type:Crimp
Operating Temperature Range:-55 - 105 °C, -55 - 302 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Contact Termination Plating Thickness:30 µin, .76 µm
Contact Underplating Material:Nickel
Sealable:No
Connector and Contact Terminate To:Wire & Cable
Wire Size:16 - 18 AWG, .8 - 1.4 mm²
Connector System:Wire to Wire
Contact Termination Plating:Gold
Contact Mating Area Plating Finish:Bright
Contact Underplating Thickness:1.27 µm, 50 µin
Wire Insulation Support:Without
Contact Retention:With
Test Current:13 A
For Multiple Crimp:No
Contact Retention Type in Housing:Crimp Snap-In
Color Code:Blue/Blue
Crimp Area Plating Finish:Gold
Crimp Area Plating Thickness:30 µin, .76 µm
Special Features:Loose Piece
Contact Product Type:Contact
Mating Pin Diameter:.062 in, 1.57 mm
Part Aliases:200333-8
SKU:AMP200333-8

Detailed Description

Introducing the SKT CONT ASSY, SZ 16, TYPE II, a crucial component in the AMP Type II series. This contact assembly features a durable brass construction with a gold plating, ensuring reliable signal transmission in industrial applications. With a contact size of 16 and a termination method of crimping, it is compatible with 16-18 AWG wires. Each package includes 4000 pieces, conveniently housed in a reel for easy storage and access. RoHS compliant and rated for operating temperatures between -55 to 105°C, this contact assembly guarantees performance and longevity in various electronic systems.