1963854-2

AMP1963854-2
Heilind Number:AMP1963854-2
Manufacturer:TE Connectivity
Manufacturer Number:1963854-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

HEAT SINK SFP DWDM 10.0mm TALL

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Specifications

AttributeValue
Product Category:
Solid State Relays & Components Solid State Relay Components
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1963854-2
Accessory Type:Clip
Body Material:Aluminum, Cold-Forged Aluminum
Device Type:SFP
GPL:J33
GPL Description:Data and Devices
Product Code:L030
Body Plating Material:Electroless Nickel
ECCN:EAR99
Number of Fins:50
Fin Style:Pin Fin
Power:10 W, 15 W, 5 W
Part Aliases:1963854-2
SKU:AMP1963854-2

Detailed Description

Introducing the 1963854-2, a high-performance HEAT SINK specifically designed for SFP DWDM modules with a slim 10.0mm profile. This aluminum cooling solution features Cold-Forged construction and Electroless Nickel plating for optimal heat dissipation and durability. With 50 Pin Fin style fins, it efficiently dissipates heat generated by 15W, 10W, and 5W power levels, ensuring reliable performance. This RoHS-compliant accessory, part of the J33 Data and Devices series, is essential for maintaining the integrity and longevity of SFP DWDM modules in various applications. Upgrade your thermal management system with the L030 HEAT SINK for enhanced performance and reliability.