1963850-2

Heilind Number:AMP1963850-2
Manufacturer:TE Connectivity
Manufacturer Number:1963850-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

XFP. MSA HEATSINK 10mm TALL

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1963850-2
Series:XFP
Accessory Type:Clip
Body Material:Aluminum, Cold-Forged Aluminum
Device Type:XFP
GPL:J33
GPL Description:Data and Devices
Product Code:L030
Body Plating Material:Electroless Nickel
ECCN:EAR99
Height:10 mm, .394 in
Width:18 mm
Number of Fins:72
Fin Style:Pin Fin
Power:10 W, 15 W, 5 W
Part Aliases:1963850-2
SKU:AMP1963850-2

Detailed Description

Introducing the XFP MSA HEATSINK, designed to efficiently dissipate heat and enhance the performance of your XFP devices. This aluminum heatsink features a low profile of 10mm, making it ideal for space-constrained applications. With a durable cold-forged aluminum construction and electroless nickel plating, it ensures reliable and long-lasting thermal management. The innovative Pin Fin design, with 72 fins, maximizes heat transfer, allowing for a power capacity of up to 15W. RoHS compliant and designed for data and device applications, this heatsink is a crucial accessory for maintaining optimal operating conditions for your XFP devices.