1963850-2
XFP. MSA HEATSINK 10mm TALL
The XFP MSA HEATSINK, designed to efficiently dissipate heat and enhance the performance of your XFP devices. This aluminum heatsink features a low profile of 10mm, making it ideal for space-constrained applications. With a durable cold-forged aluminum construction and electroless nickel plating, it ensures reliable and long-lasting thermal management. The innovative Pin Fin design, with 72 fins, maximizes heat transfer, allowing for a power capacity of up to 15W. RoHS compliant and designed for data and device applications, this heatsink is a crucial accessory for maintaining optimal operating conditions for your XFP devices.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1963850-2 |
| Series: | XFP |
| Accessory Type: | Clip |
| Body Material: | Aluminum, Cold-Forged Aluminum |
| Device Type: | XFP |
| GPL: | J33 |
| GPL Description: | Data and Devices |
| Product Code: | L030 |
| Body Plating Material: | Electroless Nickel |
| ECCN: | EAR99 |
| Height: | 10 mm, .394 in |
| Width: | 18 mm |
| Number of Fins: | 72 |
| Fin Style: | Pin Fin |
| Power: | 10 W, 15 W, 5 W |
| Part Aliases: | 1963850-2 |
| SKU: | AMP1963850-2 |
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |