| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1963850-2 |
| Series: | XFP |
| Accessory Type: | Clip |
| Body Material: | Aluminum, Cold-Forged Aluminum |
| Device Type: | XFP |
| GPL: | J33 |
| GPL Description: | Data and Devices |
| Product Code: | L030 |
| Body Plating Material: | Electroless Nickel |
| ECCN: | EAR99 |
| Height: | 10 mm, .394 in |
| Width: | 18 mm |
| Number of Fins: | 72 |
| Fin Style: | Pin Fin |
| Power: | 10 W, 15 W, 5 W |
| Part Aliases: | 1963850-2 |
| SKU: | AMP1963850-2 |
1963850-2
Specifications
Detailed Description
Introducing the XFP MSA HEATSINK, designed to efficiently dissipate heat and enhance the performance of your XFP devices. This aluminum heatsink features a low profile of 10mm, making it ideal for space-constrained applications. With a durable cold-forged aluminum construction and electroless nickel plating, it ensures reliable and long-lasting thermal management. The innovative Pin Fin design, with 72 fins, maximizes heat transfer, allowing for a power capacity of up to 15W. RoHS compliant and designed for data and device applications, this heatsink is a crucial accessory for maintaining optimal operating conditions for your XFP devices.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
| TE Connectivity 1489951-1 | ![]() | |
| TE Connectivity 1658871-1 | ![]() | |
| TE Connectivity 1658945-1 | ![]() | |
| TE Connectivity 1888101-1 | ![]() | |
| TE Connectivity 2170435-1 | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/30/2026 | PCN-25-249613 - Manufacturing location change. TE's on-going supply chain risk management strategy, the listed products are to be migrated to production sites from Zhuhai China plant to Dongguan China plant. | Download | |||







