1761825-1

AMP1761825-1
ICC Number:AMP1761825-1
Manufacturer:TE Connectivity
Manufacturer Number:1761825-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

MJ,R/A,1X3,8P,SHLD,PCB PNL GNDS

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Specifications

AttributeValue
Product Category:
RJ Connectors & Components RJ Jacks
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1761825-1
Amperage:1.5 A, .2 A
Housing Material:Nylon
Mount Type:Panel
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Pitch:.04 in, 1.02 mm
USOC Codes:RJ45
LAN Category:Cat 3
Number of Positions:8
Housing Color:Black
Mount Orientation:Right Angle
Latch Orientation:Standard - Latch Down
GPL:A92
Profile:Standard
Connector Contact Density:Standard
Multiple Port Configuration:Ganged
Number of Loaded Positions:8
Mating Entry Location:Side
Port Configuration:Multiple Ports
Port Matrix Configuration:1 x 3
Status Indicator:None
Tail Length:.14 in, 3.56 mm
Packaging:Box and Tray, Package
Operating Temperature Range:-40 - 185 °F, -40 - 85 °C
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:1.27 µm, 50 µin
Shielded:Yes
Connector Height:13.63 mm, .537 in
Grounding Options:PCB Ground
Connector Type:Jack
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:0965
Modular Product Type:RJ Type Jacks & Plugs
SKU:AMP1761825-1

Detailed Description

Introducing the 1761825-1, a high-performance RJ45 modular jack designed for Cat 3 LAN applications. This right angle, surface mount connector features a durable nylon housing in sleek black, with 8 shielded positions for optimal signal integrity. Gold-plated phosphor bronze contacts ensure reliable conductivity, while a standard latch orientation and ganged port configuration offer ease of use in multiple port setups. With a compact profile and PCB grounding options, this connector is perfect for space-restricted environments. RoHS compliant and rated for operating temperatures between -40 and 85°C, the 1761825-1 guarantees both performance and reliability in data and device applications.