1565917-4
EMBOSS ASSY DDR2 SODIMM SOCKET 200P 5.2H
EMBOSS ASSY DDR2 SODIMM SOCKET 200P 5.2H is a high-quality memory card socket designed for efficient board connectivity. With a female gender and 200 copper alloy contacts in a 2-row configuration, it ensures reliable performance. The housing, made of high temperature thermoplastic and meeting UL 94V-0 standards, guarantees durability and safety. Operating at a maximum temperature of 85°C and 1.8V voltage, it is suitable for various applications. Featuring a right-angle body orientation, .6mm pitch, and standard SGRAM keying, it offers easy installation and secure connections. With gold flash contact plating and solder peg PCB retention, it ensures excellent signal integrity and stability. This RoHS-compliant socket, with a black housing color and a package quantity of 150, is ideal for memory card integration in electronic devices.
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 1565917-4 |
Series: | DDR2 SO DIMM |
Amperage: | .5 A |
Gender: | Female |
Housing Material: | High Temperature Thermoplastic |
Number of Contacts: | 200 |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Contact Material: | Copper Alloy |
Maximum Operating Temperature: | 85 °C |
Body Orientation: | Right Angle |
Pitch: | .024 in, 6 mm |
Voltage: | 1.8 V |
Socket Type: | Memory Card |
Row Spacing: | .244 in, 6.2 mm |
Keying: | Standard |
Package Quantity: | 150 |
Key Type: | SGRAM |
Latch Material: | Stainless Steel |
Contact Amperage: | .5 A |
Number of Positions: | 200 |
Housing Color: | Black |
GPL: | 053 |
Profile: | Standard |
Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
Circuit Application: | Power |
Contact Mating Area Plating: | Gold Flash |
PCB Retention: | With |
PCB Contact Termination Area Plating: | Gold Flash |
PCB Retention Type: | Solder Peg |
Sealable: | No |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 2969 |
Connector System: | Cable-to-Board |
ECCN: | EAR99 |
Stack Height: | .205 in, 5.2 mm |
Ejector Type: | Locking |
PCB Mounting Style: | Surface Mount |
Ejector Location: | Both Ends |
Latch Plating: | Tin |
Center Key: | None |
DRAM Type: | Double Data Rate (DDR) |
Insertion Style: | Cam-In |
Socket Style: | SO DIMM |
Module Orientation: | Right Angle |
Standards Met: | UL 94V-0 |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 1565917-4 |
SKU: | AMP1565917-4 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
01/05/2022 | PCN-21-123177 - Document Updated. Please be aware the listed documents have been updated to improve clarity (not affecting specification of product). Add the alternative raw material for SODIMM contacts. Reason for Change: Due to global metal supply constraint, we can’t get enough metal materials(current: C44250), So we want to add the qualified material (C7025) for alternative raw materialBefore: Only one raw material. After: Add a alternative material. | Download |
03/01/2020 | P-19-018358 - Manufacturing Location Change -TE Connectivity (TE) is moving the manufacturing location of the products listed below from TE Shanghai to TE Qingdao. | Download |