| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1410188-3 |
| Series: | MULTIGIG RT 2 |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 112 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .071 in, 1.8 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | F029 |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Right |
| Part Aliases: | 1410188-3 |
| SKU: | AMP1410188-3 |
1410188-3
Specifications
Detailed Description
The MULTIGIG RT T2 7RW DC DF F-RGT is a high-performance board-to-board connector designed for demanding aerospace, defense, and marine applications. With a rugged construction and operating temperature range of -55 to 105°C (-67 to 221°F), this connector is ideal for use in harsh environments. Featuring 112 contacts arranged in 7 rows with a right-angle body orientation, it offers efficient power and signal transmission in space-constrained systems. Fully shrouded and with a mating alignment for polarization, it ensures secure and reliable connections. With its board mount design and pitch of 1.8mm (.071 in), the MULTIGIG RT T2 7RW DC DF F-RGT is suitable for high-density applications, making it a versatile solution for backplane connectivity in mission-critical systems. Please note, this product is not RoHS compliant.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |