The MULTIGIG RT T2 7RW DC DF F-RGT is a high-performance board-to-board connector designed for demanding aerospace, defense, and marine applications. With a rugged construction and operating temperature range of -55 to 105°C (-67 to 221°F), this connector is ideal for use in harsh environments. Featuring 112 contacts arranged in 7 rows with a right-angle body orientation, it offers efficient power and signal transmission in space-constrained systems. Fully shrouded and with a mating alignment for polarization, it ensures secure and reliable connections. With its board mount design and pitch of 1.8mm (.071 in), the MULTIGIG RT T2 7RW DC DF F-RGT is suitable for high-density applications, making it a versatile solution for backplane connectivity in mission-critical systems. Please note, this product is not RoHS compliant.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1410188-3
Series:MULTIGIG RT 2
Amperage:1 A
Gender:Plug
Number of Contacts:112
Number of Rows:7
Mount Type:Board Mount
Body Orientation:Right Angle
Pitch:.071 in, 1.8 mm
Row Spacing:.053 mm, 1.35 in
Number of Positions:112
Mount Orientation:Right Angle
GPL:B54
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Power & Signal
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:F029
Number of Columns:16
Connector System:Board to Board
Board to Board Configuration:Right Angle
Shroud Type:Fully
Card Slot Centerline:20.3 mm, .8 in
Guide Location:Right
Part Aliases:1410188-3
SKU:AMP1410188-3

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
07/01/2024P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly processDownload