MULTIGIG RT T2 .8 DC DF CT 7 ROW is a high-performance board-to-board connector designed for demanding aerospace, defense, and marine applications. Featuring a rugged right-angle body orientation, this connector ensures secure and reliable power and signal transmission in harsh environments. With 105 contacts arranged in 7 rows, it offers ample connectivity for complex systems. Operating temperature range of -55 to 105°C (-67 to 221°F) guarantees performance in extreme conditions. Fully shrouded and with polarization for mating alignment, it provides added protection and ease of use. RoHS compliant, this connector meets stringent environmental standards, making it ideal for a wide range of high-reliability applications.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1410147-2
Series:MULTIGIG RT 2
Amperage:1 A
Gender:Plug
Number of Contacts:105
Number of Rows:7
Mount Type:Board Mount
Body Orientation:Right Angle
Pitch:.071 in, 1.8 mm
Row Spacing:.053 mm, 1.35 in
Number of Positions:105
Mount Orientation:Right Angle
GPL:B54
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Power & Signal
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:F029
Number of Columns:15
Connector System:Board to Board
Board to Board Configuration:Right Angle
Shroud Type:Fully
Card Slot Centerline:20.3 mm, .8 in
Guide Location:Center
Part Aliases:1410147-2
SKU:AMP1410147-2

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
07/01/2024P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly processDownload
07/17/2023P-23-024381 - Product Improvement. Adding a new mold cavity for the organizer. Increase production and reduce the lead time. No Form, Fit, and Function on the affected parts below.
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03/31/2023P-22-023825 - Product Change. Increase the width of the wafer slots on the housing(Shroud) by 0.09mm in order to reduce the risk of FOD (Foreign Object Debris) that can be generated by insertion of the PWB wafers during parts assembly
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03/02/2022P-21-021955 - Product improvement.To increase capacity and provide alternative manufacturing options for risk management. You are hereby informed that this second manufacturing line will be introduced on/or around March 1st , 2022. This line will follow the same strict procedure which fully maintains quality, ability to supply, and form-fit-function of the concerned products. New Manufacturing process will operate under the same certified quality management system.Download