1367500-1

Heilind Number:AMP1367500-1
Manufacturer:TE Connectivity
Manufacturer Number:1367500-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

30 POSN XFP CONN, ENHANCED

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1367500-1
Series:XFP
Connector Type:XFP
Gender:Receptacle
Housing Material:Liquid Crystal Polymer
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Contact Plating:Gold
Pitch:.031 mm, .8 in
Number of Positions:30
Packaging:Tape
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Contact Mating Area Plating:Gold
PCB Mounting Style:Double-Sided (Belly-to-Belly)
Product:XFP
Standards Met:UL 94V-0
SKU:AMP1367500-1
Contact Base Material:Phosphor Bronze
Contact Mating Area Plating Thickness:29.92 µin / .76 µm
Contact Current Rating (Max):.5 A
Data Rate (Max):10 Gb/s
Housing Color:White
Housing Material:LCP (Liquid Crystal Polymer)
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Product Type:Connector
Product Line:XFP
Connector System:Cable-to-Board
Form Factor:XFP
Connector and Contact Terminates To:Printed Circuit Board

Detailed Description

Introducing the 1367500-1, a high-performance XFP connector designed for robust connectivity in demanding applications. This receptacle boasts UL 94V-0 standards compliance, ensuring superior safety and reliability. Constructed with a housing made of Liquid Crystal Polymer and featuring surface mount termination, it offers exceptional durability and ease of installation. With 30 positions and a pitch of .031mm, it provides efficient signal transmission in high-speed environments. Gold contact plating guarantees optimal conductivity, even in harsh operating conditions ranging from -55 to 85°C. RoHS compliant and featuring double-sided PCB mounting, this XFP connector is the perfect choice for mission-critical systems. Elevate your connectivity with the 1367500-1.