1060984-1
5862 5002 09,OSX PCB JACK
The OEG Power PCB relay OSA, a high-performance MCX RF connector designed for seamless board mount installation. This straight jack connector features a durable brass body with gold plating, ensuring reliable signal transmission in demanding environments. With a low impedance of 50 Ω and an impressive operating frequency of 6 GHz, it is ideal for high-speed data applications. The through hole solder termination method guarantees secure and stable connections, while the snap-on mating type allows for easy and efficient installation. RoHS compliant and suitable for a wide range of industries, this MCX connector is a versatile and dependable solution for your connectivity needs.
Details
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 1060984-1 |
Series: | OEG Power PCB relay OSA |
Gender: | Jack |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Solder |
Contact Plating: | Gold |
Body Orientation: | Straight |
Mating Type: | Snap-On |
Impedance: | 50 Ω |
Operating Frequency: | 6 GHz |
RF Connector Type: | MCX |
Body Material: | Brass |
Body Shape: | Circular |
Number of Positions: | 1 |
Mount Orientation: | Vertical |
Interface: | MCX |
Port Configuration: | Single Port |
Tail Length: | .115 in, 2.92 mm |
Operating Temperature Range: | -65 - 165 °C, -85 - 329 °F |
PCB Retention: | Without |
Sealable: | No |
Connector and Contact Terminate To: | Printed Circuit Board |
Number of Coaxial Contacts: | 1 |
Number of Mounting Legs: | 4 |
Body Finish: | Plated |
Body Plating Material: | Gold |
Center Contact Plating Material: | Gold |
Center Contact Material: | Beryllium Copper |
Center Contact Plating Thickness: | 1397 µin |
Detent: | Without |
Dielectric Material: | TFE Fluorocarbon |
Height Above PC Board: | .211 in, 5.36 mm |
Mated Outer Diameter (Approximate): | .137 in, 3.48 mm |
Connector System: | Cable to Board |
Part Aliases: | 1060984-1 |
SKU: | AMP1060984-1 |
Compliance
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
10/01/2021 | P-21-020806 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |