Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 104074-5 |
Series: | AMPMODU System 50 |
Amperage: | 3.6 A |
Housing Material: | Liquid Crystal Polymer |
Number of Contacts: | 25 |
Number of Rows: | 1 |
Termination Method: | Through Hole - Solder |
Contact Material: | Copper Alloy |
Body Orientation: | Right Angle |
Pitch: | .05 in, 1.27 mm |
Contact Type: | Pin |
Number of Positions: | 25 |
Mount Orientation: | Right Angle |
Contact Mating Area Plating: | Gold |
Header Type: | Shrouded |
Product: | Board-to-Board Headers & Receptacles |
Operating Voltage: | 30 VAC |
Standards Met: | UL 94V-0 CSA LR7189,UL E28476 |
SKU: | AMP104074-5 |
104074-5
Specifications
Detailed Description
Introducing the AMPMODU System 50 Board-to-Board Header, featuring a high-performance design for seamless connectivity in electronic applications. With 25 gold-plated contacts, this header ensures reliable signal transmission, meeting stringent UL 94V-0, CSA LR7189, and UL E28476 standards for safety and quality. The right-angle body orientation and through-hole solder termination method offer easy installation onto PCBs. Constructed with durable liquid crystal polymer housing and copper alloy contacts, this header guarantees long-lasting performance in demanding environments. Suitable for mezzanine and board stacking connections, it has a pitch of 1.27mm (.05in) and can accommodate up to 3.6A of current at 30VAC. Trust in the AMPMODU System 50 Header for efficient and secure board-to-board connectivity in your electronic designs.