The AMPMODU System 50 Board-to-Board Header, featuring a durable Liquid Crystal Polymer housing that meets UL 94V-0, CSA LR7189, and UL E28476 standards for enhanced safety. With 40 gold-plated pin contacts in a right-angle, shrouded design, this header ensures reliable connectivity in high-density applications. Each contact is constructed from a robust copper alloy, rated for 3.6 A of current at 30 VAC. Designed for through-hole solder termination, with a pitch of 1.27 mm (.05 in) and row spacing of 2.54 mm (.1 in), this header offers precise and secure mounting on PCBs. Perfect for mezzanine and board stacking connections, the AMPMODU System 50 header guarantees high performance and longevity in demanding environments. ( 104069-6)
E-16-015544 - Product Improvement. STANDARDIZATION OF REPLACEMENT TOOLING AS CURRENT TOOLS ARE WORN. CHANGES BEING MADE DO NOT AFFECT FUNCTION OF PART. PARTS WILL FUNCTION THE SAME AS CURRENT PRODUCT DOES.
