100751-1

ICC Number:AMP100751-1
Manufacturer:TE Connectivity
Manufacturer Number:100751-1
Datasheet:3DDrawing
ECAD Model:
3D Model

Description:

Z-PACK/N M-HSG 3P.

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 100751-1
Series:Z-PACK 2mm HM
Housing Material:Glass-Filled Polyester
Number of Rows:1
Mount Type:Board Mount
Pitch:.295 in, 7.5 mm
Row Spacing:.295 in, 7.5 mm
Number of Positions:3
Housing Color:Gray
Mount Orientation:Vertical
GPL:472
Packaging:Tube
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Connector Height:13.45 mm, .529 in
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:6186
Number of Columns:3
Connector Length:24.95 mm, .981 in
Connector System:Board to Board
ECCN:EAR99
Mating Retention:With
Connector and Housing Type:Plug
Material Flammability Standard:UL 94V-0
Part Aliases:2-42938-5115 100751-1
SKU:AMP100751-1

Detailed Description

Introducing the Z-PACK/N M-HSG 3P, part of the Z-PACK 2mm HM series. This high-speed backplane connector features a durable glass-filled polyester housing in a sleek gray color, meeting UL 94V-0 flammability standards for added safety. With one row of three positions and a 7.5mm pitch, it offers reliable board-to-board connectivity in vertical mount orientation. Operating in a wide temperature range from -55 to 125°C, or -67 to 257°F, it is suitable for various environments. The connector, with a low profile of .529 inches, or 13.45mm, is ideal for space-constrained applications. Packaged in a convenient tube, it ensures easy handling and storage. RoHS compliant and designed for printed circuit board termination, this connector is perfect for high-speed data and device applications.