100745-3

AMP100745-3
ICC Number:AMP100745-3
Manufacturer:TE Connectivity
Manufacturer Number:100745-3
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Z-PACK/L M-HSG 06P.

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 100745-3
Series:Z-PACK 2mm HM
Housing Material:Glass-Filled Polyester
Number of Rows:1
Mount Type:Board Mount
Pitch:.295 in, 7.5 mm
Row Spacing:.295 in, 7.5 mm
Number of Positions:6
Housing Color:Gray
Mount Orientation:Vertical
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Connector Height:13.45 mm, .529 in
Sealable:No
Mating Alignment:With
Mating Alignment Type:Multi-Purpose Center
Connector and Contact Terminate To:Printed Circuit Board
Number of Columns:6
Connector Length:1.966 in, 49.9 mm
Connector System:Board to Board
Mating Retention:With
Connector and Housing Type:Plug
Material Flammability Standard:UL 94V-0
Part Aliases:100745-3
SKU:AMP100745-3

Detailed Description

Introducing the Z-PACK/L M-HSG 06P, a high-performance backplane connector designed for reliable board-to-board connections in demanding environments. With a pitch of 7.5mm and UL 94V-0 flammability standard, this 6-position connector ensures robust and secure connectivity. Its glass-filled polyester housing in a sleek gray color offers durability and visual appeal. Operating efficiently in a wide temperature range from -55 to 125°C, it is suitable for various applications. The connector features a vertical mount orientation and a mating alignment system for easy installation. With RoHS compliance and a connector system of Board to Board, the Z-PACK/L M-HSG 06P is the ideal choice for your connectivity needs.