1-969973-0

ICC Number:AMP1-969973-0
Manufacturer:TE Connectivity
Manufacturer Number:1-969973-0
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2x10P HV100 REC. CON, SMD, GOLD, BLISTER

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-969973-0
Series:AMPMODU HV-100/HV-190
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Straight
Pitch:.1 in, 2.54 mm
Contact Type:Socket
Row Spacing:.1 in, 2.54 mm
Package Quantity:600
Number of Positions:20
Mount Orientation:Vertical
GPL:281
Profile:Standard
Mating Entry Location:Bottom & Top
Packaging:Tube
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
Connector Height:.244 in, 6.2 mm
Sealable:No
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:0337
Contact Layout:Inline
Stackable:Yes
ECCN:EAR99
Contact Protection Type:Closed Entry Housing
Application Solder Feature:Board Standoff
Connector Assembly Type:PCB Mount Receptacle
Material Flammability Standard:UL 94V-0
Part Aliases:1-969973-0
SKU:AMP1-969973-0

Detailed Description

The AMPMODU HV-100/HV-190 is a versatile board-to-board connector designed for high-density applications. With a pitch of 2.54mm (.1 in) and featuring 20 gold-plated contacts, this connector ensures reliable signal transmission in industrial settings. Its straight socket design and surface mount termination method make it easy to integrate into PCB assemblies. Constructed with a liquid crystal polymer housing and UL 94V-0 flammability rating, it guarantees durability and safety. The connector's stackable and vertical mount orientation offers flexibility in design, while its closed entry housing and gold contact plating provide added protection against environmental factors. RoHS compliant and with ECCN EAR99, the AMPMODU HV-100/HV-190 is the ideal choice for high-reliability applications.