| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1-5223083-3 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 120 Ω |
| Package Quantity: | 12 |
| Contact Amperage: | 3 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 17 mm, .668 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3964 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Contact Mating Area Plating Finish: | Matte |
| Connector Width: | 17.8 mm, .701 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | .06 µm, 2.362 µin |
| Mating / Unmating Configuration: | Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1-5223083-3 |
| SKU: | AMP1-5223083-3 |
1-5223083-3
Specifications
Detailed Description
Introducing the FB-5R,ASY,120,SIG,HDR,3LEV SEQ Z-PACK Future Bus+ connector, a high-performance board mount solution for power and signal applications. With 120 impedance-matched pin contacts arranged in a matrix layout across five rows, this connector ensures reliable data and device connectivity. Constructed with durable LCP housing and featuring gold-plated phosphor bronze contacts, it offers excellent signal integrity and can handle up to 3A of current at 30V AC. Designed for through-hole press-fit termination on 2.4mm thick PCBs, it guarantees secure and stable board-to-board connections. With a wide operating temperature range of -67 to 257 °F and UL 94V-0 flammability standard compliance, it is suitable for use in harsh environments. RoHS compliant and with ECCN EAR99 classification, this connector is ideal for a variety of applications, from telecommunications to industrial control systems. Elevate your connectivity solutions with the FB-5R connector.

