| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1-5223007-0 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 300 Ω |
| Package Quantity: | 4 |
| Contact Amperage: | 3 A |
| Number of Positions: | 300 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 300 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .139 in, 3.53 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1-5223007-0 |
| SKU: | AMP1-5223007-0 |
1-5223007-0
Specifications
Detailed Description
The 1-5223007-0 is a high-performance board-to-board PCB connector from the Z-PACK Future Bus+ series, designed for robust signal and power transmission in electronic systems. Featuring a 5-row layout with 300 socket contacts, this connector ensures reliable connectivity in demanding applications. Constructed with a durable LCP housing and phosphor bronze contacts plated with gold, it offers excellent conductivity and longevity. With a low impedance of 300 Ω and a high voltage rating of 30 V AC, it is suitable for a wide range of power and signal applications. This connector is RoHS compliant and operates efficiently in extreme temperatures ranging from -67 to 257 °F, making it ideal for use in harsh environments. Whether you're designing industrial equipment or telecommunications systems, the 1-5223007-0 is the perfect choice for high-speed, high-density connectivity.
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |