1-2213617-1

ICC Number:AMP1-2213617-1
Manufacturer:TE Connectivity
Manufacturer Number:1-2213617-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

HERM BLADE & RCPT ,LATCH, POST,SEL GOLD

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-2213617-1
Housing Material:Liquid Crystal Polymer
Mount Type:Board Mount
Termination Method:Surface Mount
Pitch:4 mm
Contact Type:Hermaphroditic
Contact Amperage:6 A
Number of Positions:2
Housing Color:Black
Mount Orientation:Horizontal
GPL:K50
Packaging:Pocket tape on reel
Circuit Application:Power
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:1.52 - 3.04 µm
PCB Retention:Without
Contact Underplating Material:Nickel
Sealable:No
Mating Alignment:Without
GPL Description:Industrial
Product Code:L833
Connector System:Board to Board
Board to Board Configuration:Co-Planar
Contact Mating Area Plating Finish:Matte
PCB Mount Alignment:With
PCB Mount Alignment Type:Peg
Header Type:Header Only
Connector Assembly Type:PCB Mount Hermaphroditic Connector
Material Flammability Standard:UL 94V-0
Part Aliases:1-2213617-1
SKU:AMP1-2213617-1

Detailed Description

The 1-2213617-1 is a high-performance board-to-board PCB connector designed for power applications in industrial settings. Featuring a hermaphroditic contact type with gold plating, this connector ensures reliable and low-resistance connections, even in demanding environments. With a current rating of 6A and UL 94V-0 flammability standard compliance, it guarantees safety and efficiency. The liquid crystal polymer housing in a sleek black color offers excellent durability and thermal performance. With a horizontal mount orientation and surface mount termination, it is easy to install and suitable for tight spaces. Packaged in pocket tape on reel for convenience, the L833 connector is a versatile solution for your board stacking needs. Rest assured, it is RoHS compliant, meeting the latest environmental standards. Trust the 1-2213617-1 for seamless and robust connectivity in your applications.