1-1761199-2

AMP1-1761199-2
ICC Number:AMP1-1761199-2
Manufacturer:TE Connectivity
Manufacturer Number:1-1761199-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

6 POSN SE SDL RCPT W/BDLK

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Specifications

AttributeValue
Product Category:
RJ Connectors & Kits RJ Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-1761199-2
Gender:Receptacle
Housing Material:Polyester - GF
Mount Type:Board Mount
Contact Material:Phosphor Bronze
Contact Plating:Gold
Pitch:.05 in, 1.27 mm
Keying:A
Number of Conductors:6
Contact Amperage:1.5 A
Number of Positions:6
Housing Color:Black
GPL:340
Shield Material:Brass
Shield Plating Material:Tin over Nickel
Operating Temperature Range:-20 - 80 °C, -4 - 176 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:50 µin
PCB Retention:With
PCB Retention Type:Boardlock
Grounding Options:PCB and Panel Ground
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1002
Connector System:Cable-to-Board
Housing Entry Style:Side
Receptacle Configuration:Standard
Standards Met:UL 94V-0
Material Flammability Standard:UL 94V-0
Part Aliases:1-1761199-2
SKU:AMP1-1761199-2

Detailed Description

Introducing the 1-1761199-2, a high-performance RJ connector designed for reliable signal transmission in data and device applications. This UL 94V-0 compliant receptacle features a durable polyester housing with glass fiber reinforcement, ensuring robust board mount installation. Constructed with phosphor bronze contacts plated in gold, it offers superior conductivity and corrosion resistance. With a pitch of 1.27mm and 6 positions, it accommodates multiple connections with ease. The black housing color and side entry style provide versatility in installation. Operating in a wide temperature range of -20 to 80°C, this connector is suitable for various environments. RoHS compliant and with a PCB and panel ground option, it guarantees compatibility and safety. Trust the 1-1761199-2 for seamless connectivity in your network infrastructure.