1-172520-3

ICC Number:AMP1-172520-3
Manufacturer:TE Connectivity
Manufacturer Number:1-172520-3
Datasheet:Drawing
ECAD Model:
3D Model

Description:

LOW PRO MINI AMP-IN HDR 13P

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-172520-3
Housing Material:Nylon GF
Number of Rows:1
Mount Type:Board Mount
Pitch:.098 in, 2.5 mm
Voltage:250 V AC, 250 V DC
Contact Type:Pin
Package Quantity:500
Number of Positions:13
Housing Color:Natural
Mount Orientation:Vertical
GPL:392
Profile:Low
Packaging:Bag
Operating Temperature Range:-40 - 105 °C, -40 - 221 °F
Circuit Application:Signal
Panel Mount:Without
PCB Retention:Without
PCB Contact Termination Area Plating:Pre-Tin
PCB Thickness (Recommended):.047 - .063 in, 1.19 - 1.6 mm
Connector Height:.14 in, 5 mm
Sealable:No
GPL Description:Appliances
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1308
Contact Layout:Inline
Connector Length:1.42 in, 33.5 mm
Connector System:Wire to Board
Mating Retention:Without
PCB Mount Alignment:Without
Header Type:Shrouded
Connector Assembly Type:PCB Mount Header
Contact Retention:Without
Material Flammability Standard:UL 94V-0
Part Aliases:1-172520-3
SKU:AMP1-172520-3

Detailed Description

Introducing the 1-172520-3, a low-profile mini amp-in header featuring 13 pins for efficient signal transmission in electronic appliances. Constructed with durable Nylon GF housing material in a natural color, this connector ensures reliable performance. With a board mount design and a pitch of 2.5mm, it offers easy installation on PCBs with a thickness ranging from 1.19 to 1.6mm. Operating at temperatures between -40 and 105°C, it is suitable for various environments. Compliant with UL 94V-0 flammability standards and RoHS, this connector guarantees safety and environmental responsibility. With a package quantity of 500, it is ideal for bulk applications in the wire-to-board connector system. Upgrade your electronic assemblies with the 1-172520-3 for seamless and secure connectivity.