1-146465-9

ICC Number:AMP1-146465-9
Manufacturer:TE Connectivity
Manufacturer Number:1-146465-9
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

19 MODII HDR SRST UNSHRD STKG

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-146465-9
Amperage:3 A
Housing Material:Thermoplastic
Number of Rows:1
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.1 in, 2.54 mm
Contact Type:Pin
Number of Positions:19
Mount Orientation:Vertical
Contact Mating Area Plating:Tin-Lead
Header Type:Breakaway
Stack Height:.7 in, 17.78 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP1-146465-9

Detailed Description

Introducing the 1-146465-9, a high-quality board-to-board header featuring 19 positions arranged in a single row for seamless connectivity. With a low amperage of 3A, this thermoplastic housing and copper alloy contact construction ensure reliable performance. The through-hole solder termination method offers secure installation, while the 2.54mm pitch and vertical mount orientation save space on your PCB. Each pin boasts tin-lead plating in the contact mating area for enhanced durability. This breakaway header has a stack height of 17.78mm, making it ideal for various applications. Please note that this product is not RoHS compliant. Trust in the 11464659 for efficient and dependable board-to-board connections.