| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol Aerospace |
| Manufacturer Part Number: | Amphenol Aerospace D38999/20FE35BN |
| Military Specification: | MIL-DTL-38999 |
| Series: | MIL-DTL-38999 Series III |
| Shell Size: | 17 |
| Shell Material: | Aluminum |
| Shell Type: | Wall Mount Flange Receptacle |
| Shell Finish: | Electroless Nickel |
| Insert Arrangement: | E35 |
| Keying Position: | N |
| SKU: | AAND38999/20FE35BN |
D38999/20FE35BN
| Heilind Number: | AAND38999/20FE35BN |
| Manufacturer: | Amphenol Aerospace |
| Manufacturer Number: | D38999/20FE35BN |
| ECAD Model: | |
Description:
MIL-DTL-38999 III (D38999) harsh environment connectors consist of wall mount receptacles, jam nut receptacles, and straight self-locking RFI plugs. They are offered in 9 shell sizes and 54 insert arrangements, utilizing M39029 contacts in sizes 22D, 20, 16, 12, 10 power, and 8 twinax. 38999 Series 3 connectors are offered in a variety of shell materials, including aluminum, stainless steel, and lightweight composite. They are also available in a wide assortment of plating options, including olive drab cadmium, nickel, black zinc nickel, and passivated stainless steel. Selection includes RoHS-compliant, cadmium-free finishes, as well as Boeing BACC-approved designs.
More >>Specifications
Detailed Description
MIL-DTL-38999 III (D38999) harsh environment connectors, identified by the SKU D38999/20FE35BN, offer robust connectivity solutions in demanding settings. This specific variant is a wall mount receptacle, featuring a total of 55 removable crimp contacts for secure and efficient connections. With a shell size of 17 and contact size 22D(55), it is designed for high performance in extreme temperatures ranging from -65°C to 200°C. The connector is constructed from aluminum with an electroless nickel finish, ensuring both durability and conductivity. Meeting military specification MIL-DTL-38999 III, as well as being RoHS compliant, this product is ideal for use in aerospace, defense, and other high-reliability applications.
