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Stock Location
2-Day Assembly! NA
Factory Lead 140 Days
Factory Stock 0
Minimum 1100
Multiple 1100
1,100 $0.93157 E
2,200 $0.93157 E
7,700 $0.77000 E


2.54mm Pitch SIM Card Connector, Push-Push Style, 6 Circuits, Surface Mount, with Solder Tabs, without Pegs, Housing Height 2.60mm, Lead-Free

Tariff Info: HTS: 85366940

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More Information
Product Category: Connectors, IC and Component Sockets, Memory Sockets and Connectors, SIM, Micro-SIM and UIM Memory Card Connectors
Manufacturer Molex
Manufacturer Part Number 105034-0001
Part Status New Business Not Supported
Material High Temperature Thermoplastic
Duration at Max. Process Temperature (seconds) 003
Lead Free Process Capability REFLOW
Max. Cycles at Max. Process Temperature 002
Max Solder Process Temperature 250 °C
Operating Temperature Range -40 - 85 °C
PCB Locator Yes
PCB Retention Yes
Packaging Embossed Tape on Reel
Shell Material Stainless Steel
Contact Mating Area Plating Gold over Nickel
Contact Termination Plating Tin
Contact Mating Area Plating Thickness 2.54 mm
Contact Termination Plating Thickness 2.54 mm
Mating Cycles 5000
Number of Contacts Loaded 6
Card Detection Switch No
Card Entry Location Front
Part Aliases 105034-0001;1050340001
Country of Origin China, Hong Kong
Low Halogen Status Not Low-Halogen
UPC 883906113438
Connector Type mini-SIM
Comment Housing Height: 2.60mm<BR>Without Post
EU ELV Compliance Not Relevant
EU RoHS Compliance Compliant
Voltage 50 V DC
Shielded Yes
Amperage .5 A
Manufacturer Molex
Contact Material Copper Alloy
Contact Plating Gold over Nickel
Maximum Operating Temperature 85 °C
Minimum Operating Temperature -40 °C
Pitch 2.54 mm
Termination Method Surface Mount
Series 105034 - mini-SIM
Housing Material Thermoplastic
Number of Contacts 6
Color Black
Internal Part #: MOL105034-0001

Product Change Notifications

Effective Date Description of Change Download
6/30/2016 GCM 10739344 - Change In Packaging Specifications. The purpose of this letter is to inform you that we will improve the packing method for nylon plastic bag. it includes: for SIM/TF series: Add vacuum packing bag and suggestion label on the bag, and also add desiccant into the bag. for SATA series: change the packing bag to MBB. This change is to prevent the HSG blister risk to improve the quality performance. 105034-0001
1/1/2016 GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. 105034-0001

Environmental Initiative Details

Environmental Initiative: ROHS
Compliant ?: RoHS Compliant Yes
Expected Date of Compliance: Unknown
Date of this Information: Unknown
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